Thermal
PCB18 Steady Thermal Prediction
Adjust the hot-boundary temperature to predict the steady temperature field on the registered PCB18 assembly sampling points.
Published scope
The inputs, geometry and outputs below follow the registered public case. Published verification applies only to the stated conditions. Service availability requires a live request.
Direct Parametric MLP
Heat generated by electronic components spreads through the circuit board and surrounding structure. This case uses a three-dimensional PCB model with multiple heat-generating regions.
The case predicts the steady-state temperature distribution for the submitted thermal condition, revealing hot spots and overall heat dissipation.
- Geometry
- PCB18 multi-body CAD surface
- Geometry scope
- same_geometry_only
Adjustable inputs
| Input | Range | Default |
|---|---|---|
| Hot boundary temperature | 60.0 – 140.0 °C | 100.0 |
Output fields
- Steady temperature field: Temperature
Registered verification
- registered_status
- passed
- summary
- The registered 80 degC holdout passed the frozen RMSE, Relative L2, and Correlation thresholds.
- holdout_parameters
- hot_boundary_temperature: 80.0
- holdout_metrics
- RMSE: 15.4611; Relative L2: 0.112176; Correlation: 0.909796
- thresholds
- max_rmse: 25.0; max_relative_l2: 0.25; min_correlation: 0.9
Recorded workflow evidence
- Project opening
- PASS
- Save and reopen
- NOT_RUN
- Training
- PASS
- Prediction
- PASS
- Independent accuracy
- PASS
- Portable validation
- NOT_RUN
These are recorded checks; they do not establish live service availability or accuracy for every new request.